Dynamic quantity sensor and method of manufacturing the same
US8225660B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 2, 2010 |
| Grant date | Jul 24, 2012 |
| Priority date | — |
| Expiry date | Feb 3, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D48/50
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A dynamic quantity sensor includes a sensor chip, a base member, and bumps. The sensor chip includes a semiconductor substrate, a sensor part, and sensor pads electrically coupled with the sensor part. The base member includes a base substrate and base pads disposed on the base substrate. The bumps mechanically and electrically couple the sensor pads and the base pads, respectively, in a state where the sensor chip is curved with respect to the base member. The sensor pads include input pads and output pads. The first surface of the semiconductor substrate includes a first portion and a second portion. The first portion is closer to the base substrate than the second portion is. At least one of the input pads is disposed on the first portion and at least one of the output pads is disposed on the second portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.