Materials for polishing liquid for metal, polishing liquid for metal, method for preparation thereof and polishing method using the same
US8226849B2 · kind B2 · utility
1Cited by
35References
18Claims
0Family size
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Key dates
| Filing date | May 17, 2006 |
| Grant date | Jul 24, 2012 |
| Priority date | — |
| Expiry date | May 17, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/3212
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
Provided are a metal-polishing liquid that comprises an oxidizing agent, an oxidized-metal etchant, a protective film-forming agent, a dissolution promoter for the protective film-forming agent, and water; a method for producing it; and a polishing method of using it. Also provided are materials for the metal-polishing liquid, which include an oxidized-metal etchant, a protective film-forming agent, and a dissolution promoter for the protective film-forming agent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.