Prepreg and printed wiring board using thin quartz glass cloth
US8227361B2 · kind B2 · utility
5Cited by
2References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 28, 2009 |
| Grant date | Jul 24, 2012 |
| Priority date | — |
| Expiry date | Nov 1, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T442/2992
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
It is an object of the present invention to provide a high frequency-capable printed wiring board material reduced in the dielectric loss tangent, weight, thickness and cost without compromising the workability, and provide electronic components using the same. The present invention provides a prepreg obtained by using a quartz glass cloth composed of low-density quartz glass fibers as a base material and impregnating the cloth with a thermosetting resin composition having a low dielectric loss tangent, and provides electronic components using a cured product of the prepreg as an insulating layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.