Patent · US Active

Dielectric film and layer testing

US8228090B2 · kind B2 · utility

0Cited by
9References
20Claims
0Family size

Assignee

Inventors

Key dates

Filing dateApr 11, 2011
Grant dateJul 24, 2012
Priority date
Expiry dateApr 11, 2031

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L22/34
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

A system for testing and a method for making a semiconductor device is disclosed. A preferred embodiment includes a conductor overlying a dielectric layer. The conductor is coupled to a first test pad via a first conducting line and to a second test pad via a second conducting line.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.