Circuit and photo sensor overlap for backside illumination image sensor
US8228411B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 15, 2011 |
| Grant date | Jul 24, 2012 |
| Priority date | — |
| Expiry date | Dec 15, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/8063
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of operation of a backside illuminated (BSI) pixel array includes acquiring an image signal with a first photosensitive region of a first pixel within the BSI pixel array. The image signal is generated in response to light incident upon a backside of the first pixel. The image signal acquired by the first photosensitive region is transferred to pixel circuitry of the first pixel disposed on a frontside of the first pixel opposite the backside. The pixel circuitry at least partially overlaps the first photosensitive region of the first pixel and extends over die real estate above a second photosensitive region of a second pixel adjacent to the first pixel such that the second pixel donates die real estate unused by the second pixel to the first pixel to accommodate larger pixel circuitry than would fit within the first pixel.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.