Integrated circuit packaging system with conductive pillars and method of manufacture thereof
US8232141B2 · kind B2 · utility
111Cited by
15References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 5, 2011 |
| Grant date | Jul 31, 2012 |
| Priority date | — |
| Expiry date | Apr 5, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of manufacture of an integrated circuit packaging system includes: providing a substrate; forming a conductive pillar, having substantially parallel vertical sides, in direct contact with the substrate; mounting an integrated circuit to the substrate beside a conductive pillar location; and encapsulating the integrated circuit with an encapsulation having a top surface formed for the conductive pillar to extend beyond.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.