Substrate carrier for wet chemical processing
US8236151B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 5, 2010 |
| Grant date | Aug 7, 2012 |
| Priority date | — |
| Expiry date | Jan 8, 2031 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D17/08
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A carrier provides the ability to perform wet chemical processing on substrates using low cost equipment inspired by the electroplating methods typically utilized in leadframe-based semiconductor packaging or printed circuit board industries. Two frame pieces are mated together to form the carrier which enables transport of at least one substrate through wet chemical processing and includes a non-conductive frame with an exposed conductive flange to allow electrical coupling with processing equipment. Electrical contacts within the non-conductive frame make contact with the at least one substrate and are coupled to the conductive flange allowing an electrical potential to develop across the substrate while undergoing processing within the electroplating equipment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.