Transistor and method for fabricating the same
US8236696B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Dec 27, 2007 |
| Grant date | Aug 7, 2012 |
| Priority date | — |
| Expiry date | Dec 27, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D30/6212
Abstract
A method for fabricating a semiconductor device to enlarge a channel region is provided. The channel region is enlarged due to having pillar shaped sidewalls of a transistor. The transistor includes a fin active region vertically protruding on a substrate, an isolation layer enclosing a lower portion of the fin active region, and a gate electrode crossing the fin active region and covering a portion of the fin active region. An isolation layer is formed enclosing a lower portion of the fin active region and the isolation layer under the spacers is partially removed to expose a portion of the sidewalls of the fin active region. Subsequently, dry etching is performed to form the sidewalls having a pillar/neck.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.