Polyamide-imide resin, process for production of polyamide resin, and curable resin composition
US8236906B2 · kind B2 · utility
2Cited by
3References
7Claims
0Family size
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Key dates
| Filing date | Mar 20, 2007 |
| Grant date | Aug 7, 2012 |
| Priority date | — |
| Expiry date | Jan 21, 2028 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L79/085
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A process for production of a polyamide resin having a reactive double bond, the process including a step of reacting a carboxylic acid and a diisocyanate to produce a polyamide resin, wherein the carboxylic acid component includes a carboxylic acid with a reactive double bond. Also, a polyamideimide resin obtainable by reacting a diisocyanate with a diimidedicarboxylic acid and a reactive double bond-containing carboxylic acid, which has a reactive double bond.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.