Method and apparatus for reducing down time of a lithography system
US8237132B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 17, 2009 |
| Grant date | Aug 7, 2012 |
| Priority date | — |
| Expiry date | Dec 20, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05G2/0086
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An apparatus includes a radiation source that emits a radiation beam that causes substantially all of a quantity of material to evaporate; and structure having first and second surface portions, a first operational mode wherein a greater quantity of a byproduct of the evaporation impinges on the first surface portion, and a second operational mode wherein a greater quantity of the byproduct impinges on the second surface portion. A different aspect involves emitting a radiation beam toward a quantity of material, the radiation beam causing substantially all of the quantity of material to evaporate; operating a structure having first and second surface portions in a first operational mode wherein a greater quantity of a byproduct of the evaporation impinges on the first surface portion; and thereafter operating the structure in a second operational mode wherein a greater quantity of the byproduct impinges on the second surface portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.