Advanced quad flat non-leaded package structure and manufacturing method thereof
US8237250B2 · kind B2 · utility
15Cited by
112References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 17, 2009 |
| Grant date | Aug 7, 2012 |
| Priority date | — |
| Expiry date | Feb 24, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The advanced quad flat non-leaded package structure includes a carrier, a chip, a plurality of wires, and a molding compound. The carrier includes a die pad and a plurality of leads. The leads include first leads disposed around the die pad, second leads disposed around the first leads and at least an embedded lead portion between the first leads and the second leads. The wires are disposed between the chip, the first leads and the embedded lead portion. The advanced quad flat non-leaded package structures designed with the embedded lead portion can provide better electrical connection.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.