Inspection system and a method for detecting defects based upon a reference frame
US8238645B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 29, 2006 |
| Grant date | Aug 7, 2012 |
| Priority date | — |
| Expiry date | Jun 27, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67288
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method for inspecting objects and an inspection system, the system includes: an image acquisition unit adapted to acquire multiple images, according to a predefined image acquisition scheme, of multiple portions of a diced wafer that comprises multiple dice; and a processor adapted to locate multiple unique features within the multiple images, at least partially during the acquisition of images; associate multiple unique features with multiple dice, at least partially during the location of multiple unique features; determine multiple transformations between multiple die coordinate systems and a global coordinate system, in response to a locations of unique features and their associations with multiple dice, at least partially during an association between multiple unique features with multiple dice; and detect defects in response to a comparison between dice and corresponding reference dice, in response to the transformations, at least partially during the determination of the multiple transformations.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.