Insert molded printhead substrate
US8246141B2 · kind B2 · utility
28Cited by
5References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 21, 2006 |
| Grant date | Aug 21, 2012 |
| Priority date | — |
| Expiry date | Aug 15, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49002
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A marking assembly includes a substrate and a marking device. The substrate includes a first portion made from a first material including a plurality of alignment features, and a second portion made from a second material affixed to the first portion of the substrate. The marking device is affixed to the second portion of the substrate and aligned to the alignment features of the first portion of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.