Copper on organic solderability preservative (OSP) interconnect and enhanced wire bonding process
US8247272B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 22, 2009 |
| Grant date | Aug 21, 2012 |
| Priority date | — |
| Expiry date | Nov 19, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/2076
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package and a method for constructing the package are disclosed. The package includes a substrate and a die attached thereto. A first contact region is disposed on the substrate and a second contact region is disposed on the die. The first contact region, for example, comprises copper coated with an OSP material. A copper wire bond electrically couples the first and second contact regions. Wire bonding includes forming a ball bump on the first contact region having a flat top surface. Providing the flat top surface is achieved with a smoothing process. A ball bond is formed on the second contact region, followed by stitching the wire onto the flat top surface of the ball bump on the first contact region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.