Rodel Manalac
3Patents
1h-index
17Co-inventors
37Inventor score
Filing activity: Mar 30, 2004 → Oct 20, 2011
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7109570B2 | Integrated circuit package with leadframe enhancement and method of manufacturing the same | Electricity | 6 | Expired |
| US8592258B2 | Semiconductor package and method of attaching semiconductor dies to substrates | Electricity | 0 | Active |
| US8247272B2 | Copper on organic solderability preservative (OSP) interconnect and enhanced wire bonding process | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.