Polishing slurry for aluminum and aluminum alloys
US8251777B2 · kind B2 · utility
2Cited by
4References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 11, 2008 |
| Grant date | Aug 28, 2012 |
| Priority date | — |
| Expiry date | Apr 5, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F77/42
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The invention is directed to a method of polishing a surface of an object that includes aluminum. The method includes the step of contacting the surface of the object with a soft polishing pad and a polishing composition. The polishing composition includes abrasive particles, an agent that oxidizes aluminum, and a liquid carrier to polish the surface of the object. The polishing composition includes the abrasive particles suspended in the liquid carrier, and is applied at a pH above about 7.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.