Flux-free chip to wafer joint serial thermal processor arrangement
US8252678B2 · kind B2 · utility
3Cited by
1References
12Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 31, 2010 |
| Grant date | Aug 28, 2012 |
| Priority date | — |
| Expiry date | Dec 31, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A serial thermal processing arrangement for treating a pre-assembled chip/wafer assembly of semiconductor material in a rotary processor, through a series of intermittent, rotatively advanced, movements into independent, temperature and pressure controlled, circumferentially disposed chambers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.