Electronic element packaging module
US8253041B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 20, 2010 |
| Grant date | Aug 28, 2012 |
| Priority date | — |
| Expiry date | Feb 25, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic element packaging module including a lead frame, an insulating layer and at least one electronic element is provided. The lead frame is a patterned metal sheet and has a first surface, a second surface opposite thereto and a through trench passing from the first surface to the second surface. A substrate portion and a plurality of lead portions around the substrate portion of the lead frame are defined by the through trench. The second surface of the lead frame is exposed outside the electronic element packaging module. The insulating layer disposed in the through trench has a third surface and a forth surface substantially coplanar with the first and the second surfaces, respectively. The electronic element disposed on the first surface is coupled to the lead frame.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.