Mounting substrate
US8254140B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 22, 2009 |
| Grant date | Aug 28, 2012 |
| Priority date | — |
| Expiry date | Oct 7, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/101
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A mounting substrate includes a substrate, a bonding pad and an induction heating pad. The bonding pad is formed on the substrate, and adhered to a solder ball to mount a semiconductor chip on the substrate. The induction heating pad is disposed adjacent to the bonding pad, the induction heating pad being induction heated by an applied alternating magnetic field to reflow the solder ball. The induction heating pad having a diameter greater than a skin depth in response to the frequency of the applied alternating magnetic field is selectively induction heated in response to a low frequency band of the alternating magnetic field. Accordingly, during a reflow process for a solder ball, the semiconductor chip may be mounted on the mounting substrate to complete a semiconductor package without damaging the mounting substrate, to thereby improve the reliability of the completed semiconductor package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.