Pressure sensor having a cap above a first diaphragm connected to a hollow space below a second diaphragm

US8256299B2 · kind B2 · utility

Assignee

• Robert Bosch GmbH · DE

Inventors

• Michaela Mitschke · Reutlingen, DE
• Hubert Benzel · Neckartenzlingen, DE

Key dates

• Filing date: Nov 9, 2009
• Grant date: Sep 4, 2012
• Expiry date: Nov 19, 2030

Classification

• Technology area (CPC G): Physics
• CPC primary: G01L27/007
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

A micromechanical pressure sensor includes a first diaphragm and a second diaphragm accommodated in a shared semiconductor substrate. The two diaphragms facilitate independent pressure sensing of one or more media, by the fact that a respective pressure variable is sensed by way of the deflection of the respective diaphragm. A cap above the first diaphragm defines a hollow space that is connected to the hollow space below the second diaphragm.