Printed circuit board with improved via design
US8258411B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 27, 2009 |
| Grant date | Sep 4, 2012 |
| Priority date | — |
| Expiry date | Apr 22, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A circuit board includes an electrically conductive sheet having an insulative coating surrounding the conductive sheet, with a surface of the insulative coating around an edge of the conductive sheet having an arcuate or rounded shape. At least one electrical conductor is conformally deposited on at least the rounded insulative coating around the edge of the conductive sheet and defined via photolithographic and metallization techniques. Each electrical conductor on the insulative coating thereon around the edge of the conductive sheet conforms to the arcuate or rounded shape of the insulative coating and, therefore, has an arcuate or rounded shape.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.