Leveler compounds
US8262891B2 · kind B2 · utility
7Cited by
17References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 2, 2006 |
| Grant date | Sep 11, 2012 |
| Priority date | — |
| Expiry date | Feb 15, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/423
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Leveling agents for metal plating baths are provided. Plating baths containing such leveling agents provide metal deposits having substantially level surfaces. Such leveling agents may be selected to selectively incorporate desired levels of impurities into the metal deposit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.