Ceramic package substrate with recessed device
US8264846B2 · kind B2 · utility
17Cited by
8References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 14, 2006 |
| Grant date | Sep 11, 2012 |
| Priority date | — |
| Expiry date | Jun 8, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10734
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A ceramic package substrate has a recess. This allows a device in that recess to be close to a die attached to the substrate's top side, for better performance. The device may be an array capacitor, an in-silicon voltage regulator, or another device or devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.