David Bach
2Patents
2h-index
8Co-inventors
33Inventor score
Filing activity: Dec 28, 2001 → Dec 14, 2006
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8264846B2 | Ceramic package substrate with recessed device | Electricity | 17 | Active |
| US6812485B2 | Dual interposer packaging for high density interconnect | Electricity | 2 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.