Mold compounds in improved embedded-die coreless substrates, and processes of forming same
US8264849B2 · kind B2 · utility
39Cited by
2References
29Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 23, 2010 |
| Grant date | Sep 11, 2012 |
| Priority date | — |
| Expiry date | Jan 7, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49826
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus includes a coreless substrate with an embedded die that is integral to the coreless substrate, and at least one device assembled on a surface that is opposite to a ball-grid array disposed on the coreless substrate. The apparatus include an at least one stiffener layer that is integral to the coreless substrate and the stiffener layer is made of overmold material, underfill material, or prepreg material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.