Inventor · Chandler, AZ, US

John S. Guzek

83Patents
15h-index
79Co-inventors
87Inventor score

Filing activity: Dec 19, 2001 → Sep 15, 2023

Most-cited inventions

PatentTitleAreaCited byStatus
US9941245B2 Integrated circuit packages including high density bump-less build up layers and a lesser density core or coreless substrate Electricity 232 Active
US8093704B2 Package on package using a bump-less build up layer (BBUL) package Electricity 63 Active
US9136236B2 Localized high density substrate routing Electricity 60 Active
US8912670B2 Bumpless build-up layer package including an integrated heat spreader Electricity 50 Active
US9269701B2 Localized high density substrate routing Electricity 49 Active
US9153552B2 Bumpless build-up layer package including an integrated heat spreader Electricity 42 Active
US8264849B2 Mold compounds in improved embedded-die coreless substrates, and processes of forming same Emerging Cross-Sectional Technologies 39 Active
US9224674B2 Packaged semiconductor die with bumpless die-package interface for bumpless build-up layer (BBUL) packages Electricity 35 Active
US8535989B2 Embedded semiconductive chips in reconstituted wafers, and systems containing same Electricity 33 Active
US8618652B2 Forming functionalized carrier structures with coreless packages Electricity 25 Active
US8313958B2 Magnetic microelectronic device attachment Electricity 24 Active
US8901724B2 Semiconductor package with embedded die and its methods of fabrication Electricity 20 Active
US7042077B2 Integrated circuit package with low modulus layer and capacitor/interposer Electricity 19 Expired
US10170409B2 Package on package architecture and method for making Electricity 17 Active
US9679843B2 Localized high density substrate routing Electricity 16 Active
US8035218B2 Microelectronic package and method of manufacturing same Electricity 14 Active
US8513792B2 Package-on-package interconnect stiffener Electricity 14 Active
US7851269B2 Method of stiffening coreless package substrate Electricity 12 Active
US8742561B2 Recessed and embedded die coreless package Electricity 11 Active
US9520376B2 Bumpless build-up layer package including an integrated heat spreader Electricity 11 Active
US9691711B2 Method of making an electromagnetic interference shield for semiconductor chip packages Electricity 9 Active
US8786066B2 Die-stacking using through-silicon vias on bumpless build-up layer substrates including embedded-dice, and processes of forming same Electricity 9 Active
US8891246B2 System-in-package using embedded-die coreless substrates, and processes of forming same Electricity 9 Active
US7569471B2 Method of providing mixed size solder bumps on a substrate using a solder delivery head Emerging Cross-Sectional Technologies 8 Active
US9859253B1 Integrated circuit package stack Electricity 8 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.