Method and apparatus for cleaning substrates
US8267103B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 30, 2007 |
| Grant date | Sep 18, 2012 |
| Priority date | — |
| Expiry date | Apr 11, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67751
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Provided is an apparatus for cleaning and drying a substrate by applying a plurality of chemicals and gases to the substrate. The apparatus may include: a substrate support member including a chuck receiving a substrate; a first nozzle member injecting a drying fluid onto a top surface of the substrate for drying the substrate; a low cover including an opened top and enclosing the chuck; and an upper cover selectively closing the opened top of the low cover so as to dry the substrate in a closed space. Therefore, the apparatus dries a substrate more efficiently and protects the substrate from being contaminated by foreign pollutants. Furthermore, generation of an undesired oxidation layer on the substrate can be prevented.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.