Semiconductor manufacturing process modules
US8267632B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 23, 2007 |
| Grant date | Sep 18, 2012 |
| Priority date | — |
| Expiry date | Mar 30, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6719
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A system for processing semiconductor wafers including a plurality of robotic facilities serially joined to each other to form a substantially linear transport chamber through which wafers can be transferred from each facility, wherein the substantially linear transport chamber is sealed to hold a controlled atmosphere and each of the plurality of robotic facilities includes at least one scara robot having three arm links serially coupled to one another and having a substrate holder rotatably coupled at a distal end of the three arm links, the plurality of robot facilities being configured to effect the transfer of wafers through the substantially linear transport chamber via handoff a wafer between neighboring scara robots, and a multi-entry process module coupled to at least one of the plurality of robotic facilities, where each entry of the multi-entry process module is accessed by the at least one of the at least one scara robot.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.