Plating bath and method
US8268158B2 · kind B2 · utility
13Cited by
16References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 11, 2011 |
| Grant date | Sep 18, 2012 |
| Priority date | — |
| Expiry date | Aug 11, 2031 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D3/38
- WIPO fieldOrganic fine chemistry
- WIPO sectorChemistry
Abstract
Copper plating baths containing a leveling agent that is a reaction product of a certain imidazole with a certain epoxide-containing compound that deposit copper on the surface of a conductive layer are provided. Such plating baths deposit a copper layer that is substantially planar on a substrate surface across a range of electrolyte concentrations. Methods of depositing copper layers using such copper plating baths are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.