Erik Reddington
17Patents
8h-index
39Co-inventors
68Inventor score
Filing activity: Jun 4, 1999 → Jul 27, 2016
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6284402A | Electrocatalyst compositions | Emerging Cross-Sectional Technologies | 26 | Expired |
| US6911068B2 | Plating bath and method for depositing a metal layer on a substrate | Electricity | 17 | Expired |
| US8048284B2 | Metal plating compositions | Electricity | 16 | Active |
| US6773573B2 | Plating bath and method for depositing a metal layer on a substrate | Electricity | 16 | Expired |
| US6652731B2 | Plating bath and method for depositing a metal layer on a substrate | Electricity | 14 | Expired |
| US8268158B2 | Plating bath and method | Chemistry; Metallurgy | 13 | Active |
| US6736954B2 | Plating bath and method for depositing a metal layer on a substrate | Electricity | 11 | Expired |
| US8012334B2 | Metal plating compositions and methods | Chemistry; Metallurgy | 8 | Active |
| US8337688B2 | Metal plating compositions | Electricity | 7 | Active |
| US8329018B2 | Metal plating compositions and methods | Chemistry; Metallurgy | 7 | Active |
| US7384535B2 | Bath analysis | Physics | 4 | Expired |
| US8536049B2 | Method for forming metal contacts | Emerging Cross-Sectional Technologies | 2 | Active |
| US9932684B2 | Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of alpha amino acids and bisepoxides | Electricity | 1 | Active |
| US10006136B2 | Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of imidazole compounds, bisepoxides and halobenzyl compounds | Electricity | 0 | Active |
| US10100421B2 | Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of imidazole and bisepoxide compounds | Electricity | 0 | Active |
| US8956523B2 | Metal plating compositions and methods | Chemistry; Metallurgy | 0 | Active |
| US10104782B2 | Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of pyridyl alkylamines and bisepoxides | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.