Precast thermal interface adhesive for easy and repeated, separation and remating
US8268389B2 · kind B2 · utility
0Cited by
3References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 8, 2010 |
| Grant date | Sep 18, 2012 |
| Priority date | — |
| Expiry date | Oct 9, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2861
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Precast curable thermal interface adhesives facilitating the easy and repeatable separation and remaining of electronic components at thermal interfaces thereof, and a method for implementing the foregoing repeatable separation and remating at the thermal interfaces of components through the use of such adhesives.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.