Submount for optical device and its manufacturing method
US8269301B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 4, 2007 |
| Grant date | Sep 18, 2012 |
| Priority date | — |
| Expiry date | Jun 15, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8581
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Submounts for mounting optical devices which have an excellent heat radiating property and can be formed in a wafer state in batch are provided.A metallized electrode including optical device mounting parts and wiring parts is formed on a surface of a first substrate containing an insulating material as a main component, a through hole is formed in a glass substrate serving as a second substrate, the optical device mounting parts of the first substrate are aligned to be located inside the through hole of the second substrate, and the first substrate and the second substrate are joined together by use of a method such as anodic bonding.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.