Semiconductor packages including heat slugs
US8269342B2 · kind B2 · utility
3Cited by
1References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 1, 2010 |
| Grant date | Sep 18, 2012 |
| Priority date | — |
| Expiry date | Oct 7, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package may include at least one semiconductor chip mounted on a substrate, a molding layer adapted to mold the at least one semiconductor chip, a heat slug, on the molding layer, having a structure in which a dielectric is provided between conductors, and a through mold via electrically connecting the heat slug to the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.