PaLan Lee
3Patents
1h-index
15Co-inventors
34Inventor score
Filing activity: May 27, 2010 → Apr 25, 2014
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8269342B2 | Semiconductor packages including heat slugs | Electricity | 3 | Active |
| US8569114B2 | Method of forming a semiconductor device package | Electricity | 1 | Active |
| US9313889B2 | Display apparatus | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.