Simple radio frequency integrated circuit (RFIC) packages with integrated antennas
US8269671B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Jan 27, 2009 |
| Grant date | Sep 18, 2012 |
| Priority date | — |
| Expiry date | Feb 23, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19039
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A radio-frequency integrated circuit chip package has N integrated patch antennas, N being at least one. The package includes a cover portion with N generally planar patches, and a main portion coupled to the cover portion. The main portion in turn includes at least one generally planar ground plane spaced inwardly from the N generally planar patches and parallel thereto. The ground plane is formed without any coupling apertures therein. The main portion also includes N feed lines spaced inwardly from the N generally planar patches and parallel thereto, and spaced outwardly from the generally planar ground plane and parallel thereto. Furthermore, the main portion includes at least one radio frequency chip coupled to the feed lines and the ground plane. The cover portion and the main portion cooperatively define an antenna cavity, and the N generally planar patches and the chip are located in the antenna cavity. The package is formed without reflectors. Fabrication techniques are also described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.