Interposers, electronic modules, and methods for forming the same
US8273603B2 · kind B2 · utility
14Cited by
108References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 19, 2009 |
| Grant date | Sep 25, 2012 |
| Priority date | — |
| Expiry date | May 16, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49124
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In accordance with a method for forming an interposer, a fill hole is formed in a first side of a substrate and a cavity is formed in a second side. The cavity is in fluidic communication with the fill hole. A plurality of posts is formed in the cavity, and an encapsulant is injected through the fill hole into the cavity to encapsulate the plurality of posts. In accordance with a method of thermal management, an electronic component and a heat sink are disposed on opposing sides of an interposer that includes a plurality of encapsulated posts.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.