Microscopic structure packaging method and device with packaged microscopic structure
US8273653B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 3, 2009 |
| Grant date | Sep 25, 2012 |
| Priority date | — |
| Expiry date | Mar 23, 2030 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2203/0145
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A method of packaging a micro electromechanical structure is disclosed. The method comprises the steps of forming the structure on a substrate, depositing a sacrificial layer over the structure, patterning the sacrificial layer, depositing a porous layer over the patterned sacrificial layer, removing the patterned sacrificial layer through the porous layer, treating the porous layer with a plasma and depositing a capping layer over the plasma-treated porous layer. The plasma treatment step ensures that the capping layer material cannot enter the cavity formed by the removal of the sacrificial layer through the porous layer. A device formed by this method is also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.