Gerhard Koops
15Patents
3h-index
25Co-inventors
56Inventor score
Filing activity: Nov 15, 2007 → Dec 19, 2017
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8310053B2 | Method of manufacturing a device with a cavity | Electricity | 19 | Active |
| US8143971B2 | MEMS resonator | Electricity | 6 | Active |
| US8426928B2 | Device with microstructure and method of forming such a device | Performing Operations; Transporting | 4 | Active |
| US8569934B2 | Piezo-resistive MEMS resonator | Emerging Cross-Sectional Technologies | 2 | Active |
| US8818265B2 | Interface for communication between voltage domains | Electricity | 2 | Active |
| US8260098B1 | Optocoupler circuit | Electricity | 2 | Active |
| US9859818B2 | Micro-device with a cavity | Electricity | 1 | Active |
| US9142625B2 | Field plate assisted resistance reduction in a semiconductor device | Electricity | 1 | Active |
| US8906729B2 | Method of manufacturing a device with a cavity | Electricity | 1 | Active |
| US8273653B2 | Microscopic structure packaging method and device with packaged microscopic structure | Performing Operations; Transporting | 1 | Active |
| US8980698B2 | MEMS devices | Performing Operations; Transporting | 1 | Active |
| US10171007B2 | Method of manufacturing a device with a cavity | Electricity | 1 | Active |
| US9017561B2 | Piezo-resistive MEMS resonator | Emerging Cross-Sectional Technologies | 0 | Active |
| US8330238B2 | Microscopic structure packaging method and device with packaged microscopic structure | Performing Operations; Transporting | 0 | Active |
| US8592228B2 | Sealing structure and method of manufacturing the same | Performing Operations; Transporting | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.