Flux-free chip to substrate joint serial linear thermal processor arrangement
US8274161B2 · kind B2 · utility
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15Claims
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Key dates
| Filing date | Jan 7, 2011 |
| Grant date | Sep 25, 2012 |
| Priority date | — |
| Expiry date | Mar 24, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/01322
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A linear, serial chip/substrate assembly processing machine for stepwise advancing a pre-assembled chip/die substrate on a support plate through a series of sealable chambers beginning at a loading station and ending up at an unloading station after various melting and vacuuming of chip/substrate components has been stepwise indexed through those various chambers to the final joining thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.