Patterned wafer inspection system using a non-vibrating contact potential difference sensor
US8275564B2 · kind B2 · utility
1Cited by
2References
16Claims
0Family size
Assignee
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Key dates
| Filing date | Jan 26, 2010 |
| Grant date | Sep 25, 2012 |
| Priority date | — |
| Expiry date | Mar 12, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L22/14
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A method and system for inspecting a surface of a material having a repeating pattern of relative work function. The method and system processes sensor data to identify data characteristic of the repeating pattern, and the sensor data is then further processed to remove the data characteristic of the repeating data, leading to a characteristic of non-uniformities of the material surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.