Sensor device
US8276446B2 · kind B2 · utility
3Cited by
1References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 26, 2010 |
| Grant date | Oct 2, 2012 |
| Priority date | — |
| Expiry date | Apr 11, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48091
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A sensor device includes a housing base part, a bearer part, a chip structure situated on the bearer part, and a spring/damper combination via which the housing base part and the bearer part are elastically connected to one another. In the sensor device, the housing base part, the spring/damper combination and the bearer part are situated one over the other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.