Method for manufacturing semiconductor device and semiconductor manufacturing apparatus
US8276537B2 · kind B2 · utility
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1References
9Claims
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Key dates
| Filing date | Jan 18, 2011 |
| Grant date | Oct 2, 2012 |
| Priority date | — |
| Expiry date | Jan 18, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/10
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In one embodiment, a method for manufacturing a semiconductor device is disclosed. The method can include, upon attaching a bonding material containing a resin and a solvent to a second surface opposed to a first surface including a circuit pattern of a wafer, heating the bonding material to evaporate the solvent and decreasing vapor pressure of the solvent in an atmosphere faced with the bonding material and heating the attached bonding material to form a bonding layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.