Polishing pad and polishing device
US8277290B2 · kind B2 · utility
4Cited by
3References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 31, 2009 |
| Grant date | Oct 2, 2012 |
| Priority date | — |
| Expiry date | Dec 25, 2030 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/22
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing pad used in semiconductor polishing process is provided in the present invention and a pressure sensitive adhesive is used to couple the polishing pad. The polishing pad includes a substrate, and the substrate includes a polishing surface and a reverse surface corresponding to the polishing surface. The polishing pad is characterized by: a pressure sensitive adhesive formed on the reverse surface of the substrate and used to couple with a bottom layer, and the horizontal adhesion of the pressure sensitive adhesive is higher than the vertical adhesion of the pressure sensitive adhesive.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.