BESTAC ADVANCED MATERIAL CO., LTD.
6Patents
6Active
6Granted
43Portfolio score
Filing activity: Jun 16, 2008 → Aug 24, 2010 · 6 expiring within 5 years
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7662028B2 | Polishing pad having groove structure for avoiding stripping of a polishing surface of the polishing pad | Performing Operations; Transporting | 9 | Active |
| US8123597B2 | Polishing pad | Emerging Cross-Sectional Technologies | 5 | Active |
| US8277290B2 | Polishing pad and polishing device | Performing Operations; Transporting | 4 | Active |
| US8343586B2 | Conductive polishing pad and method for making the same | Emerging Cross-Sectional Technologies | 0 | Active |
| US9889630B2 | Polishing equipment having discontinuous adhesion points and method for making the sheet | Emerging Cross-Sectional Technologies | 0 | Active |
| US8491359B2 | Polishing pad, use thereof and method for making the same | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.