Method for packaging semiconductor device
US8278145B2 · kind B2 · utility
0Cited by
1References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 6, 2011 |
| Grant date | Oct 2, 2012 |
| Priority date | — |
| Expiry date | Apr 6, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10674
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention provides a method for packaging semiconductor device which is using more than once reflow processes to heat the solder ball to prevent the deformation of solder ball, so that the yield of the manufacturing process can be increased and the reliability of the semiconductor device can be increased.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.