Longqiang Zu
10Patents
5h-index
6Co-inventors
55Inventor score
Filing activity: May 27, 1999 → May 20, 2018
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6303871A | Degassing hole design for olga trace impedance | Emerging Cross-Sectional Technologies | 15 | Expired |
| US6594153B1 | Circuit package for electronic systems | Electricity | 15 | Expired |
| US9666544B2 | Package substrate differential impedance optimization for 25 GBPS and beyond | Electricity | 12 | Active |
| US6177732A | Multi-layer organic land grid array to minimize via inductance | Electricity | 10 | Expired |
| US8152048B2 | Method and structure for adapting solder column to warped substrate | Emerging Cross-Sectional Technologies | 6 | Active |
| US6879494B2 | Circuit package for electronic systems | Electricity | 5 | Expired |
| US8247909B2 | Semiconductor package device with cavity structure and the packaging method thereof | Electricity | 2 | Active |
| US10410984B1 | Package substrate differential impedance optimization for 25 to 60 GBPS and beyond | Electricity | 1 | Active |
| US8278145B2 | Method for packaging semiconductor device | Electricity | 0 | Active |
| US10276519B2 | Package substrate differential impedance optimization for 25 to 60 Gbps and beyond | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.