Pressure sensor and method

US8278727B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Thoralf Kautzsch · Dresden, DE
• Marco Müller · Aachen, DE
• Dirk Meinhold · Dresden, DE
• Ben Rosam · Dresden, DE
• Klaus Elian · Alteglofsheim, DE
• Stefan Kolb · Unterschleißheim, DE

Key dates

• Filing date: Jan 4, 2010
• Grant date: Oct 2, 2012
• Expiry date: Dec 4, 2030

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B81B2201/0264
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

A method for providing a pressure sensor substrate comprises creating a first cavity that extends inside the substrate in a first direction perpendicular to a main surface of the substrate, and that extends inside the substrate, in a second direction perpendicular to the first direction, into a first venting area of the substrate; creating a second cavity that extends in the first direction inside the substrate, that extends in parallel to the first cavity in the second direction, and that does not extend into the first venting area; and opening the first cavity in the first venting area.