Semiconductor device packages including connecting elements
US8278746B2 · kind B2 · utility
106Cited by
195References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 2, 2010 |
| Grant date | Oct 2, 2012 |
| Priority date | — |
| Expiry date | Sep 15, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1815
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Described herein are wafer-level semiconductor device packages with stacking functionality and related stacked package assemblies and methods. In one embodiment, a semiconductor device package includes a set of connecting elements disposed adjacent to a periphery of a set of stacked semiconductor devices. At least one of the connecting elements is wire-bonded to an active surface of an upper one of the stacked semiconductor devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.