Patent · US Active

Method for simultaneously cutting a compound rod of semiconductor material into a multiplicity of wafers

US8282761B2 · kind B2 · utility

2Cited by

5References

13Claims

0Family size

Assignee

Siltronic AG · DE

Inventors

Alexander RIEGER · Haag in Oberbayern, DE
Hans Oelkrug · Tittmoning, DE
Josef Schuster · Birkenfeld, DE

Key dates

Filing date	Oct 14, 2009
Grant date	Oct 9, 2012
Priority date	—
Expiry date	Jul 20, 2030

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T428/192
WIPO fieldOther special machines
WIPO sectorMechanical engineering

Abstract

A method for simultaneously cutting a compound rod of semiconductor material into a multiplicity of wafers. The method includes selecting a first workpiece and a second workpiece, each having two end surfaces; grinding at least one of the two end surfaces of each workpiece so as to create a ground end surface on each workpiece; cementing the ground end surface of the first workpiece to the ground end surface of second workpiece using a fastener so as to produce a compound rod piece having a longitudinal axis, wherein the fastener is disposed between the workpieces so as create a distance between the workpieces; fixing the compound rod piece in a longitudinal direction on a mounting plate; clamping the mounting plate with the compound rod piece in a wire saw; and cutting the compound rod piece perpendicularly to the longitudinal axis using the wire saw.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.