Printed circuit board and manufacturing method thereof
US8282841B2 · kind B2 · utility
0Cited by
4References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 31, 2008 |
| Grant date | Oct 9, 2012 |
| Priority date | — |
| Expiry date | Aug 10, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1184
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed circuit board includes a flexible insulated substrate with a first surface and a second surface at both sides respectively, a wiring layer on the first surface, a reinforcement plate on a part of the second surface and an auxiliary layer between the second surface and the reinforcement plate. A reinforcement edge side of the reinforcement plate is located at the outside of an auxiliary edge side of the auxiliary layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.